Okamoto grinding machines are precision grinders for flat, cylindrical, internal, and rotary-surface finishing — plus specialized AEROLAP polishing and semiconductor wafer grinding. Ellison Technologies, the largest machine tool distributor in North America and a manufacturer's partner serving shops since 1955, supplies the full Okamoto line across 11 states: California, Wisconsin, North Carolina, Tennessee, Oregon, Washington, Georgia, Alabama, Mississippi, South Carolina, and Virginia. These grinders hold tight tolerances and repeatable surface finishes for die and mold, tooling, medical, automotive, and semiconductor work.
Note: Okamoto machines are available through Ellison Technologies in the following states: California, Wisconsin, North Carolina, Tennessee, Oregon, Washington, Georgia, Alabama, Mississippi, South Carolina and Virginia.
Surface & Profile Grinding
Surface & Profile Grinding
Surface grinders produce flat, parallel faces and precise profiles by passing the workpiece beneath a rotating abrasive wheel on a reciprocating table. Okamoto's surface and profile grinders are built for die and mold work, gauge and fixture making, and any job that demands a fine, repeatable flat finish.
Cylindrical & Universal Grinding
Cylindrical & Universal Grinding
Cylindrical grinders finish the outside diameter (OD) of round parts held between centers or in a chuck; universal models add internal-diameter (ID) and angle-head grinding in a single machine. Okamoto's CNC cylindrical and universal grinders pair rigid construction with multi-wheel capability for shafts, rolls, spindles, and bearing journals that must hold tight roundness and concentricity.
Internal Grinding
Internal Grinding
Internal grinders finish bores and internal diameters to high precision. Okamoto's rigid, production-oriented internal grinders suit high-volume parts such as bearing races, bushings, and hydraulic components, where bore size and surface finish are critical.
Rotary Grinding
Rotary Grinding
Rotary surface grinders use a rotating table beneath the wheel for high stock-removal rates and consistent finishes on high-volume flat parts. They fit production grinding of seals, washers, valve plates, and similar batch work where throughput matters as much as finish.
AEROLAP (Aero Lap Machine)
AEROLAP (Aero Lap Machine)
AEROLAP is Okamoto's dry, abrasive-airflow finishing process that polishes and deburrs complex shapes without changing part geometry. It shortens final-polishing cycle time on cutting tools, molds and dies, gears, and medical components.
Semiconductor Grinder & Polisher
Semiconductor Grinder & Polisher
Okamoto's semiconductor back grinders and polishers thin and finish silicon wafers in chip production. The back grinder uses an index table and down-feed grinding (with optional coin-stack and stress-relief equipment); the polisher's dedicated head and handling system deliver high-accuracy, high-throughput final polishing.
Which Okamoto grinder fits your application?
Okamoto grinder | What it finishes | Typical parts / industries |
|---|---|---|
Surface & profile | Flat faces and profiles | Dies, molds, gauges, tooling |
Cylindrical & universal | OD, ID, and angles on round parts | Shafts, rolls, spindles; aerospace, automotive |
Internal | Bores and internal diameters | Bearing races, bushings; high-volume production |
Rotary | Flat, high-volume batch parts | Seals, washers, valve plates |
AEROLAP | Polishing/deburring complex shapes | Cutting tools, gears, medical components |
Semiconductor grinder & polisher | Wafer thinning and polishing | Silicon wafers; semiconductor fabrication |
FAQ Section
Where can I buy Okamoto grinding machines in the United States?
Ellison Technologies supplies Okamoto grinding machines across 11 states — California, Wisconsin, North Carolina, Tennessee, Oregon, Washington, Georgia, Alabama, Mississippi, South Carolina, and Virginia. Ellison is the largest machine tool distributor in North America and has served manufacturers since 1955.
What types of grinding machines does Okamoto make?
Okamoto builds surface and profile grinders, CNC cylindrical and universal grinders, internal grinders, rotary surface grinders, AEROLAP polishing machines, and semiconductor wafer grinders and polishers — covering flat, cylindrical, internal, and high-volume production grinding.
What is a surface grinder used for?
A surface grinder produces flat, parallel surfaces and precise profiles by moving a workpiece under a rotating abrasive wheel. It is used for dies, molds, gauges, and tooling that require a fine, accurate flat finish.
Are Okamoto grinders used in semiconductor manufacturing?
Yes. Okamoto's semiconductor back grinders and polishers thin and finish silicon wafers during chip production, using down-feed grinding and a dedicated polishing head for high-accuracy, high-throughput results.
What is Okamoto AEROLAP?
AEROLAP is Okamoto's dry, abrasive-airflow finishing process that polishes and deburrs complex parts without altering their geometry. It shortens final-polishing time on cutting tools, molds, gears, and medical components.