Designed to sell, Okamoto Corporation has a wide variety of grinding machines ranging from small, hand-feed capabilities to large, sophisticated machines. In addition, Okamoto offers high-production rotary surface models to put you in direct line of exceptional quality.
Note: Okamoto is only available through the following Ellison managed states: California, Idaho, Nevada, Oregon, Washington, Tennessee, Mississippi, Alabama, Georgia, North Carolina, South Carolina, Virgina, Maryland & Delaware.
Surface & Profile Grinding
Surface & Profile Grinding
Okamoto surface grinder lineup is covered from manual to full CNC. Table size lineup is Min 6x18" to Max 138 to 390", this is a world widest grinder manufacture.
Cylindrical & Universal Grinding
Cylindrical & Universal Grinding
Okamoto has many experience at Cylindrical and Universal grinder. Size lineup is Min OD8 x L20" to Max OD12 to L60“ with easy conversation software. And Vertical Universal grinder has OD 20” table.
Internal Grinding
Internal Grinding
Okamoto ID grinder has 70 years history all over the world. IGM series offers high accuracy grinding with conversation software. IGM series are widely used in the aerospace, automotive and oil industries.
Rotary Grinding
Rotary Grinding
Rotary grinder has many potential to reduce grinding cycle time. Okamoto has both of horizontal and vertical type grinder lineup. Table size lineup is Min OD24” to Max 47“.
Aero Lap Machine
Aero Lap Machine
AreoLap dramatically shortens cycle-time for final polishing. This process is used to improve the surface finish of tools, medical devices and cutting edge industries.
Semiconductor Grinder & Polisher
Semiconductor Grinder & Polisher
Okamoto has special Grinder and Polisher for semiconductor wafer. Okamoto has manual and fully automation system to get flattens and surface finish to semiconductor wafers.